features ? silicon epitaxial planar diode ? smd chip pattern, available in vari ous dimension included 1206 & 0603 ? leadfree and rohs compliance components mechanical characteristics ? size: 0805 ? weight: approx. 6mg ? marking: cathode terminal dimensions dimension/mm 0805 l 2.00.2 w 1.250.2 t 0.850.1 c 0.450.2 thermal characteristics parameter at t amb =25 o c symbol unit value junction temperature t j o c 175 thermal resistance junction to ambient air r ja o c/w 375 1) storage temperature range t stg o c -65 to 175 1) valid provided that electrodes are kept at ambient temperature. BAS216 switching diodes http://www.luguang.cn mail:lge@luguang.cn
electrical characteristics parameter at t amb =25 o c symbol unit value reverse voltage v r v 75 peak reverse voltage v rm v 100 forward continuous current i fm ma 300 average rectified current sin half wave rectification with resistive load f>=50hz i f(av) ma 150 1) surge forward current at t<1s and t j=25 o c i fsm ma 500 power dissipation p tot mw 400 1) forward voltage at i f =10ma v f v 1.0 max leakage current at v r =20v i r na 25 max at v r =75v i r a 5 max at v r =20v, t j =150 o c i r a 50 max capacitance at v f =v r =0v c tot pf 4 max voltage rise when switching on, tested with 50ma pulses, t p =0.1s, rise time <30ns, f p =(5-100)khz v fr v 2.5 max reverse recovery time at i f =10ma to i r =1ma, v r =6v, r l =10 0 t rr ns 4 max rectification efficiency at f=100mhz, v rf =2v r % 45 min 1) valid provided that electrodes are kept at ambient temperature. rectification efficiency measurement circuit BAS216 switching diodes http://www.luguang.cn mail:lge@luguang.cn
environmental characteristics hazardous substance or element/ppm product pb cd hg cr 6+ pbb pbde BAS216 <1000 <100 <1000 <1000 <1000 <1000 test characteristics test item test condition requirement solderability sn bath at 2505 o c for 20.5s >95% area tin covered resistance to soldering heat sn bath at 2605 o c for 102s v f ,v z & i r within spec; no mechanical damage humidity steady state at 85 o c 85%rh for 1000hrs v f ,v z & i r within spec continue forward operating life at 25 o c i f =i o 10% for 1000hrs v f ,v z & i r within spec hi-temperature reverse bias at 150 o c v r =0.8v r rated for 1000hrs v f ,v z & i r within spec thermal shock -55 5 o c/5min to 1505 o c/5min for 10cycles v f ,v z & i r within spec bending strength bending up to 2mm for 1cycle v f ,v z & i r within spec; no mechanical damage packing method product quality/reel reel size tape BAS216 5,000pcs 7? paper BAS216 switching diodes appl icat io ns ? function: fast switching ? soldering condition: reco mmended pro f ile co nditio n sn- pb so ldering leadfree so ldering wave soldering ramp-up rate (from pre-heat stage) <3 o c/s <3 o c/s t<150 o c pre-heat temp erature & time 100-150 o c 60-120s 150-200 o c 60-180s 100-150 o c 60-120s soldering temperature & tim e 183 o c 60-150s 217 o c 60-150s 2605 o c 52 o c peak temperat ure 2305 o c 2455 o c 2605 o c time within 5 o c of peak temp erature 10-30s 20-40s - ramp-down rate <6 o c/s <6 o c/s <6 o c/s time 25 o c to peak temperatur e <6min <8min - manual soldering: approx. 350 o c for 3s, avoid solder iron tip di rect touch the components body ? sto r age co nditio n: pro duct terminatio n so lderability can degrade due to high temperature and humidity or chemical environment. storage condit ion must be in an ambient temperatur e of <40 o c and ambient humidity of <80%rh, and free from chemical. http://www.luguang.cn mail:lge@luguang.cn
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